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HGT Hydraulic Gyratory Crusher

HGT Hydraulic Gyratory Crusher

HGT Gyratory Crusher is a new-type intelligent coarse crusher with big capacity and high efficiency. It integrates mechanical, hydraulic, electric, automated, and intelligent controlling technologies which grant it with advantages traditional crushing

European Type Jaw Crusher PEW

European Type Jaw Crusher PEW

Jaw crushers has stationary jaw crusher, portable jaw crusher and mobile jaw crusher (crawler jaw crusher). Jaw crusher (PEW Series) is not only able to be used together with mine-selecting and gravel processing equipments but also be used independen

Jaw Crusher PE

Jaw Crusher PE

Jaw crusher is driven by a motor, and the moving jaw moves up and down via eccentric shaft. The angle between fixed jaw and moving jaw becomes smaller when the moving jaw runs down, then the materials are crushed into pieces. It will become bigger whe

HPT Hydraulic Cone Crusher

HPT Hydraulic Cone Crusher

Base on the latest technology and decades of years’ producing experience, Our Company designed the HPT series cone crusher. It has excellent crushing efficiency and good hydraulic control system. Now the HPC series cone crusher has wide application

HST Hydraulic Cone Crusher

HST Hydraulic Cone Crusher

HST Single Cylinder Hydraulic Cone Crusher is a new high-efficiency cone crusher independently researched, developed and designed by SBM through summarizing over twenty years of experience and widely absorbing advanced American and German technologies

CI5X Series Impact Crusher

CI5X Series Impact Crusher

CI5X Impact Crusher breaks materials with impact force. When materials enter the working area of hammer, they may be crushed under the high-speed shock and then thrown onto the impact device above the rotor for another crushing. Next, materials bounce

VSI6X Series Vertical Crusher

VSI6X Series Vertical Crusher

Due to the increasing market demand for the scale, intensification, energy conservation, environment protection and high-quality machine-made sand, SBM, a Chinese professional sand maker manufacturer, further optimizes the structure and function of tr

VSI5X Vertical Shaft Impact Crusher

VSI5X Vertical Shaft Impact Crusher

VSI Crushers Working Principle Raw material falls down into feed hopper, and then enters rotor through central entrance hole. It is accelerated in high-speed rotor, and then is thrown out at speed of 60-75m/s. When hitting anvil, it is crushed. Final

VSI Vertical Shaft Impact Crusher

VSI Vertical Shaft Impact Crusher

VSI Series vertical shaft impact crusher is designed by reputed German expert of SBM and every index is in worlds leading standard. It incorporates three crushing types and it can be operated 720 hours continuously. Nowadays, VSI crusher has replaced

VUS aggregate optimization system

VUS aggregate optimization system

The VU system is a global most-advanced dry-process sand-making system. The system is constructed like a tower. Its fully-enclosed layout features high integration. It integrates the functions of high-efficiency sand making, particle shape optimizatio

MTW-Z European Trapezium Mill

MTW-Z European Trapezium Mill

MTW European Grinding Mill is innovatively designed through deep research on grinding mills and development experience. It absorbs the latest European powder grinding technology and concept, and combines the suggestions of 9158 customers on grinding m

5X Series Roller Grinding Mill

5X Series Roller Grinding Mill

Grinding roller of MB5X Pendulum Roller Grinding Mill l adopts diluted oil lubrication. It is a technology initiated domestically which is maintenance-free and easy to operate. Diluted oil lubrication is oil bath lubrication, more convenient than grea

MTW Trapezium Mill

MTW Trapezium Mill

MTW European Grinding Mill is innovatively designed through deep research on grinding mills and development experience. It absorbs the latest European powder grinding technology and concept, and combines the suggestions of 9158 customers on grinding m

LM Vertical Mill

LM Vertical Mill

LM Vertical Grinding Mill integrates crushing, drying, grinding, separating and transport. The structure is simple while the layout is compact. Its occupational area is about 50% of that of the ball-milling system. The LM grinding mill can also be arr

TGM Trapezium Mill

TGM Trapezium Mill

TGM Super Pressure Trapezium Mill The operation principle of main unit of Trapezium mill is that main unit runs with the central shaft that is driven by a gear box. The top of the shaft is connected with a quincunx stand on which a grinding roller is

applications example grinding disco

Applications Example Grinding DISCO Corporation

Applications Example 6-inch GaAs Wafer Thinning when it is Secured with Tape The results of our thinning process of 6-inch GaAs wafers affixed with tape will be introduced.

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Applications Example Grinding DISCO Corporation

Finishing grinding is possible with only one-axis grinding. In silicon wafer grinding, it is common to perform rough grinding using the first axis and finishing grinding using the second axis. The GS08 series developed this time can perform finishing grinding using the first axis only.-4 pieces of 2-inch wafers can be ground at the same time.-

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Applications Example Grinding DISCO Corporation

The amount of the wheel wear is about 2µm during about four minutes per 10µm amount of grinding in the processing time of 4-inch LT wafer. Moreover, processing results of 30 µm amount ground and 110µm final thickness have been achieved.

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Applications Example Grinding DISCO Corporation

Typically, GaAs wafers are secured with wax, but based on the application, tape securing for grinding is also possible. Processing examples GaAs is an easily damaged material, so typically wax securing is chosen for grinding due to its strong retaining force.

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Applications Example Grinding DISCO Corporation

The TAIKO process is a wafer backgrinding method developed by DISCO. This process method leaves a ring (approximately 3 mm) on the wafer outer edge and thin grinds only the inner area of the backside wafer. In this article, we will introduce the center offset grinding as application example of TAIKO grinding. What is a center offset

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Applications Example Grinding DISCO Corporation

DISCO HOME > Solutions > Applications Example > Grinding: Solutions: In the normal GaAs wafer processing, the #600 wheel is used for rough grinding. DISCO will recommend a suitable specification for a wheel to be used in the finishing grinding, after considering requested surface roughness and the wheel’s processability of the wafers.

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Applications Example Grinding DISCO Corporation

Stable grinding is now possible for the 6-inch AlTiC wafers used in the HDD head substrate and other components. Process Example Selection of optimum grinding conditions and wheel type enables stable grinding of a 6-inch wafer, which is a large size for AlTiC.

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Applications Example Grinding DISCO Corporation

Applications Example High Quality Processing of InP (Indium Phosphide) Optimization of wheels and processing parameters enables high quality processing of

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Applications Example Grinding DISCO Corporation

Warpage that occurs when the stress of backside grinding damage is larger than that of the front side is called normal warpage, which renders the wafer convex-shaped. On the other hand, concave warpage is called reverse warpage. Here, the amount of warpage caused by grinding damage will be explained.

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Applications Example Grinding DISCO Corporation

Applications Example Processing of Glass to a Mirror Surface By selecting the optimum wheel and processing conditions for the glass processing, it is possible to eliminate grinding damage of the glass.

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Applications Example Grinding DISCO Corporation

Finishing grinding is possible with only one-axis grinding. In silicon wafer grinding, it is common to perform rough grinding using the first axis and finishing grinding using the second axis. The GS08 series developed this time can perform finishing grinding using the first axis only.-4 pieces of 2-inch wafers can be ground at the same time.-

More

Applications Example Grinding DISCO Corporation

DISCO HOME > Solutions > Applications Example > Grinding: Solutions: In the normal GaAs wafer processing, the #600 wheel is used for rough grinding. DISCO will recommend a suitable specification for a wheel to be used in the finishing grinding, after considering requested surface roughness and the wheel’s processability of the wafers.

More

Applications Example Grinding DISCO Corporation

Typically, GaAs wafers are secured with wax, but based on the application, tape securing for grinding is also possible. Processing examples GaAs is an easily damaged material, so typically wax securing is chosen for grinding due to its strong retaining force.

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Applications Example Grinding DISCO Corporation

Figs. 1 and 2 show the surface roughness when grinding with a standard wheel in the TAIKO process. This shows that the same surface roughness as that of a #2000 wheel is obtained. Fig. 1: Comparison of Surface Roughness (Ra)

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Applications Example Grinding DISCO Corporation

Stable grinding is now possible for the 6-inch AlTiC wafers used in the HDD head substrate and other components. Process Example Selection of optimum grinding conditions and wheel type enables stable grinding of a 6-inch wafer, which is a large size for AlTiC.

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Applications Example Grinding DISCO Corporation

Applications Example High Quality Processing of InP (Indium Phosphide) Optimization of wheels and processing parameters enables high quality processing of

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Disco Dicing and Grinding presentations (Israel Workshop

DISCO Basic Blade Seminar. Processing mechanism; Elements of structure; Correct use of blades; Application sample; US Dicing . DISCO Basic Wheel Seminar. Use and structure of the grinding wheel; Processing mechanism; Elements of structure; Effect of grinding conditions; Usage of the wheel; Application sample . DISCO Laser Dicing Technology

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Applications Example Dicing DISCO Corporation

DISCO has developed edge trimming technologies to meet the needs for reducing the breakage rate of thin and small-diameter wafers. Edge trimming is a process that prevents wafer breakage and chipping during backside grinding and transfer by trimming the wafer edge beforehand. and some examples of its applications are presented here. Process

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Solutions for thinning, dicing and packaging of power

SiC thinning process Application Example -6 Ultrasonic grinding unit 11 DISCO continue testing the advantage of US grinding Ultrasonic wheel with built-in oscillator Non contact power supply Generate oscillation Normal spindle Ultrasonic oscilR ating

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APPLICATIONS AND ADVANTAGES OF GRINDING PROCESS

various types of grinding process in our previous post, where we have discussed each grinding process in detail. We have also discussed basic principle of grinding in our previous post, where we have seen the basics of grinding process and various abrasives materials as well as we have also noted the various factors affecting the quality of object surface created by grinding process.

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Dicing and Grinding Using the Disco Corporation

For example, if a polishing process is needed for the removal of grinding damage after wafer thinning, multiple-processing equipment capable of grinding using a grinding wheel and dry polishing lowers the risk of wafer-level breakage during wafer transfer.

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Basics of Grinding Manufacturing

grinding machines perform the dressing task automatically. The application of coolants to the grinding process is important. Coolants reduce grinding machine power requirements, maintain work quality, stabilize part dimensions, and insure longer wheel life. Coolants are either emulsions, synthetic lubricants or special grinding oils.

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Grinding of silicon wafers: A review from historical

Oct 01, 2008· For example, SSG (in-feed wafer grinding) was used for flattening of 200 mm ID-sawn wafers because of its lower overall cost of manufacturing. Another example is fine grinding of etched wafers that will be single-side polished. It is important to consider the series of machining processes (slicing, flattening, and polishing) as a system.

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Grinding SlideShare

Aug 26, 2015· Grinding 1. Grinding and Grinding Machine 2. Grinding: Grinding is a process of removing material by abrasive action of a revolving wheel on the surface of a work-piece in order to bring it to required shape and size The wheel used for performing the grinding operation is known as grinding wheel It consists of sharp crystal called abrasive held together by a binding material or bond The

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